TLV700: peak current in the operation

Hi Shinichi,

The wire bond for the TLV700 in the DCK package (SC70) has a fusing current of approximately 2A. So if the device is working in the application then the 1.16A shouldn't be a concern from a fusing current point of view however I do not have a way to evaluate the effects of repetitive nature and the customer will need to evaluate their application accordingly. 

Just to note this spike in current happens before the current limit circuit has time to respond (most LDO current limits have a response time of 20us-100us) which is why they see current above the current limit.   

Hi Shinichi,

See my answers to your questions below. 

Q1

The RMS value is probably more applicable here due to the very large spike in current however note that the device will provide more than the max value in the ROC table however that is the value for specified parameters in the EC table (accuracy, dropout, ground current, etc...). Naturally at higher currents the dropout will be higher the accuracy will be worse, etc... so the customer needs to evaluate if the performance of the device will meet their requirements. If they want the EC table parameters to apply to their application use case, they will need an LDO with a much larger output current rating (their scope shots show 1.16A so they would need an LDO specified for >=1.16A).

Q2

Using the Junction-to-top characterization parameter for the DCK package that allows us to estimate that the junction temperature is close to 50C which is not a concern from a lifetime point of view (JEDEC spec assumes ~9 year lifetime for ICs at 55C).