TPS82130: TPS82130 reflow/assembly considerations

Part Number: TPS82130

Hello,
I have a couple of questions regarding the 1.53mm height TPS82130 MicroSiP package (μSiL-8 SIL0008D):
- Are there any special reflow/assembly considerations for the μSiL-8 SIL0008D MicroSiP package? Any documents to point to aside from snva853 and slib006?
- MSL level 2 indicates that pre-reflow/assembly baking is not really required with a floor of life less than 1 year @ < 30degC 60%RH?
- what package body thickness applies for the J-STD-033 tables? Total height or laminate substrate thickness only (which is ?)?
- what is the TPS82130 laminate substrate material? Is it FR4?

Kind regards,

over 4 years ago

0 Gerold Dhanabalan - Online Design Tools over 4 years ago

TI__Genius 14455 points

We are gathering this information and will get back to you by Monday Dec 14th.

Regards,

Gerold

0 Jean Picard over 4 years ago

TI__Intellectual 1125 points

slib006.pdf snva853.pdf

See attached, these documents should provide answers to most questions.

Regards

Jean

0 AP over 4 years ago in reply to Jean Picard

Intellectual 390 points

Hi,

I would like to come back to this one.

The MSL level 2 indicates 1 year @ < 30degC 60%RH floor life.

How to reset the floor life for this one with it's T&R carrier?
Is it possible to bake the T&R reel? And up to what temperature before the tape glue suffers?

Regards,

0 Jean Picard over 4 years ago in reply to AP

TI__Intellectual 1125 points

We will look at it, however it may take some time due to holiday period, please be patient.

Regards

Jean

0 AP over 4 years ago in reply to Jean Picard

Intellectual 390 points

Hi Jean,

OK I will wait, thanks.

Please also take a look again at: For TPS82130, what package body thickness applies for the J-STD-033 Table 4-1 (Pre-Reflow Baking)? Total height (including inductor) or laminate substrate thickness only (which is not given in the mechanical drawing)?

Since none of the pointed documents seems to answer this one.

Regards,

0 Vincent Zhang(BSR) over 4 years ago in reply to AP

TI__Expert 4795 points

Hi AP,

Well received. Our U.S. team will feedback to you together after the holiday.

0 Peter James Miller over 4 years ago in reply to AP

TI__Guru 56845 points

J-STD-033 Table 4-1 "Drying Time" package thickness is based on the diffusion time to drive moisture out of the substrate, so it is the substrate thickness that should be used. Recommend using the <1.4mm thick line on the table.

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TPS82130: TPS82130 reflow/assembly considerations