Hey team,
For the TPSM265R1V3SILR do we have any feedback on the below questions? My thoughts are that the first one will be a yes and the second one depends on how well the soldering job was done.
- Will these chips be OK if an attempt to solder these by hand is made. I understand that they can take the stress of a reflow oven, but I didn’t know if this has been attempted before and failed.
- If these are soldered by hand, vs a board house’s pick and place machine, will there be any potential issues with sending these to get CE tested for EMC/EMI/Immunity testing? I don’t want to risk the cost in testing because this chip couldn’t take the stresses of hand soldering for some reason or another that TI has recommended against somewhere else.
I see from the related post we had some recommendations based on history with the part. I imagine that reflow is the best option for a safe and successful connection.
Thanks!
