Hello,
Concerning measurement of the device temperature, I have read of number of TI design documents including SPRA953C, SPRAB13B, and SPRU811A as well as JESD51-8. I see there is discussion of the use of RthJB (Theta-JB): thermal resistance from the die to the bottom of the package (board, measured 1mm from the package). And we know from the datasheet that the value of RthJB is 3.71 degrees C/W. We have situations where we cannot measure the device temperature by instrumenting a thermocouple through a hole in the heatsink and would like to use a temperature sensor to calculate the DSP temperature in various deployment situations. My questions are about using a TI digital temperature sensor (over the I2C bus) to measure the board temperature: 1) Where would be the best location? e.g. a certain side of the DSP, location along that side of the DSP, top-side, or bottom-side of the PCB? 2) What would be the best package to choose? 3) Beyond the information presented in the aforementioned TI design documents, are there other considerations that we should be aware of and what do you recommend?
Thanks in advance for your help,
Larry
