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Hi,
If passive cooling is required for the MPU:
Many thanks!
Hi Samuel.
When you mean passive cooling are you looking at Heat sinks/Fans? Or Cooling using Frequency scaling?
Best Regards,
Keerthy
Hi Keerthy,
I am referring to the heat-sinks without the use of fans.
Cheers,
Sam
Samuel,
A colleague was able to help me with this:
This is the heatsink used on TDA4VM (27x27mm) EVM It is adhesive, so can fit on DRA821 (assuming there is room around the 17x17mm device).
A similar but smaller heatsink (23mm x 23mm) is linked below
Kevin Lavery
Hi Kevin,
Thank you for the response! Are you able to answer the following three questions?
- Are there any precautions for mounting the cooling fin (glue/fasteners)
- Are there any application notes for this?
- Is the metal can on the top of the MPU connected to anything, or is it floating?
Many thanks,
Sam
Sam,
The heat sink is adhesive; that, as I understand it, answers the question about glue /fasteners. Basically, use the heat sink as recommended by the manufacturer.
I do not have an app note on this,.
The metal top of the SoC is floating.
Kevin