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AM3352: Reference design for 4 layer board

Part Number: AM3352

Hi experts,

Q1:If I use all the pins of AM335x, will the stackup be minimum 4 layers?

Q2:If possible, could you please share a design file for a 4 layer board for reference?

As far as I can see from the datasheet(For example: 7.7.2.3.3.2 Compatible JEDEC DDR3 Devices), I believe it can be achieved with 4 layers, but it would be of great help to my customer if there is some design information that can be used as a reference for the design. 

Best regards,
O.H

  • Hi O.H,

    4 layers will be a challenge with all pins brought out, and would likely be compromised on ground/ power planes.  We do not have any such reference designs.  My guess is 6 layers will be the minimum.  The BeagleBone black is a 6-layer design and is heavily optimized.  Many customers have used this as a starting point for their design, and might work for you?  The Octavo SIP might give you the option to route in 4 layers (https://www.ti.com/tool/OCTVO-3P-AM335X).  Take a look at the PocketBone as a reference to creating a 4-layer design with the Octavo SIP: octavosystems.com/.../

    Regards,
    Mike

  • Hi Michael Erdahl,

    Thank you for your reply. I understood.

    It seems that the actual essential functions will be DDR, LCD, UART, I/O, PWM (+ possibly USB, MMC), but I will pass on your feedback and information to our customers.

    Best regards,
    O.H

  • O.H,

    I think you will find that will be most of the pins on the AM335x, once it's all said and done Slight smile

    That said, the BeagleBone black layout might be an excellent starting point as it includes all the essential functions you listed.

    Regards,
    Mike