Hi,
We have referred to respective datasheet (AM3356BZCZA60). In page no.244, section 9.1, it is indicated that "
The ZCE package has been specially engineered with Via Channel technology. This allows larger than
normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the 0.65-
mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal layers
(four layers total) due to the increased layer efficiency of the Via Channel BGA technology"
In this regard, we would like to know the footprint design to incorporate above said technology. Kindly share footprint details as early as possible.
