TMS320C6455: vs TMS320C6455DZTZA8 Temperature Profile differences

Manny Salazar

Part Number: TMS320C6455

What are the thermal reflow differences between TMS320C6455DCTZA8 and TMS320C6455DZTZA8 for soldering purposes? Both devices seem identical in the datasheet with the difference being in the Pb-free solder balls and die bump.

over 4 years ago

0 Shriram Moharil over 4 years ago

TI__Expert 4770 points

Hi, I will check with the team and get back to you regarding this. It does not appear that this will require difference in reflow but I will double check and revert back.

regards,

-Shriram

+1 Shriram Moharil over 4 years ago in reply to Shriram Moharil

TI__Expert 4770 points

Please see the below document.

https://www.ti.com/lit/pdf/spru811

This contains information on solder reflow profiles for different BGA types.

The Pb-free solder actually will, in general, require higher temperature.

regards,

-Shriram

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TMS320C6455: vs TMS320C6455DZTZA8 Temperature Profile differences