Hello,
To design a product in the thermal imaging world.
the selection of appropriate processors we need your help to move ahead.
We have gone through the link below:-
https://www.ti.com/solution/thermal-imaging-camera?variantid=35029&subsystemid=23906
The information seems fair enough while selection of core components.
As we already designed a prototype with AM572x processors. Our all modules are working fine.
But we are getting failure result in thermal management scope.
The assembled electronics in mechanical housing reaches up to 90 C (processor on die temp sensor)
at ambient of 25 C only.
Although the complete mechanical design is being considered as a heat sink for natural convection.
All documents i.e. ARM & DSP thermal consideration, power estimation tool has been read out.
We did best as per our knowledge and the resources provided by TI.
Please assist us either processor selection having low power feature or optimized scheme for good
thermal management for am572x devices.
Regards
Krishna Vashistha