AM4372: Build-up PCB and multi-layer through-hole PCB

 ?Hello Kanae, 

Thank you for the query.

Could you please help me understand your query

AM4372 is used and mounted on a build-up PCB, are there any restrictions?

Please help me understand which  board are you referring to

Also, is it possible to mount AM4376 on a multi-layer through-hole PCB?

I need you help to understand the question since AM4376 is a BGA package device.

Regards,

Sreenivasa

Hi Sreenivasa,.

Thank you for your reply.

Sreenivasa:
Please help me understand which board are you referring to"

Please see the following reference site for a general description of the "build-up board (PCB)"
you are using that implements the AM4372 on your custom board.

www.atc-kr.com/.../build-up-pcb-printed-circuit-board.html

The background to our customer's question is that our customer is considering
whether the build-up board on which the AM4372 is currently mounted can be changed
to a multilayer through-hole board in order to reduce costs.
Therefore, they want to confirm if it is possible to mount AM4372 on a multilayer through-hole board.

Sreenivasa:
"I need you help to understand the question since AM4376 is a BGA package device."

Similar to the above question about AM4376, our customer just wants to confirm
whether AM4376 can be mounted on a multilayer through-hole board or not.
What exactly do you need help with?

Our customer wants to confirm the answer by June 29th, so please let us know
when you will respond if it is difficult to respond as soon as possible.

Best regards,
Kanae

Hello Kanae, 

Please refer below

What exactly do you need help with?

Also, is it possible to mount AM4376 on a multi-layer through-hole PCB?

I was trying to understand the above question. BGA getting mounted on the  through-hole PCB

Based on the inputs above, my quick thought is customer can consider a SOM and a carrier bboard option to reduce the 

Regards,

Sreenivasa

Hi Sreenivasa,.

Thank you for your prompt reply.

Sreenivasa:
"Based on the inputs above, my quick thought is customer can consider a SOM and a carrier bboard option to reduce the ..."

The sentence is broken, what do you mean by "reduce"?
The customer is looking to reduce costs.

Also, in your reply you state, "customer can consider a SOM and a carrier board option", what exactly is the option?
Does this answer mean that a multi-layer through-hole PCB cannot be used?

The customer wants to confirm a clear answer by June 29th, so please let us know
when you will respond if it is difficult to respond as soon as possible.

Best regards,
Kanae

Hello Kanae,

Please refer below 

Based on the inputs above, my quick thought is customer can consider a SOM (System on module) and a carrier board option to reduce the board size.

The customer is looking to reduce costs.

This depends on the overall board size and layer count. The SOM will have larger layer count and the carrier will have smaller count.

The customer wants to confirm a clear answer by June 29th, so please let us know when you will respond if it is difficult to respond as soon as possible.

Please note that we can provide answers related to the EVM and we do not have any suggestion regarding the PCB fab process that we do not follow. 

regards,

Sreenivasa

Hi Sreenivasa,

Thank you for your support.
I will share this with our customer.

Best regards,
Kanae