DRA821U: Is there any ESD risk through the package lid and heatsink?

Francois Charlot

Part Number: DRA821U

Hi Champs,

As the title says... I know that the processor package lid is electrically isolated from the die, but what about a large, say 8 kV, electrostatic discharge that could come from a human contact with the heat spreader? Could it damage the die inside the package?

Best regards,
François.

over 3 years ago

+1 Robert Eschler over 3 years ago

TI__Guru 51695 points

Yes - processor package lid is electrically isolated from die. TI does not do any ESD testing between lid and die. Human Body Model (HBM) ESD testing is performed on each TI product. The HBM stress is a pin to pin (BGA ball to BGA ball) stress method and is not typically performed above 2,000 volts for this type of product. Semiconductor devices which are more typically used as an external interface device may have these external pins stress to higher voltages.

0 Francois Charlot over 3 years ago in reply to Robert Eschler

TI__Mastermind 28057 points

Thank you, Robert.

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DRA821U: Is there any ESD risk through the package lid and heatsink?