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Dear experts,
In the TDA4VM DM, the recommended pad size is 0.4 and 0.47mm, but in the EVM, the pad size is 0.4572mm and 0.6096mm. The ball size is 0.45mm and 0.55mm. Could you tell me which is the recommended BGA pad size for PCB design? Thanks.
In theory - the EVM is solution is optimal. However - both solutions should provided same performance based on TI's testing.