struggling with bga and pbga sockets

Hello,

Custom packaging is done on a case by case basis, it's uncertain whether it can be done or not, but I would assume more likely if it's a big or worthwhile order. You would have to contact the marketing representative for the specific device and situation and they would be able to give you a proper answer.

Regards,

Robert Regojo.

Hi Robert:

Thank you very much for your answer.

I was wondering whether TI has something similar to this: http://www.directinsight.co.uk/products/swiftmodule/SwiftModule-dm3730-am3703.html

This way, the access to the complicated packaging of the microprocessors is done by means of an intermediary prototype that can be plugged into a custom PCB.

Best Regards,

Hello,

I'm unsure if we have anything similar to that. Do you have a specific device(s) in mind for what you need? I may be able to direct you to someone who may know better on the subject.

Regards,

Robert Regojo.

Hi again Robert:

In principle we are interested in any device that can support Android Froyo 2.2 as stated here: OMAP35x AM35x AM37x DM37x.

The particular problem of BGA packaging is that requires multiple layers within the PCB that difficults its implementation with 'usual' hardware development tools.

Thanks again,

Regards

Hi all,

Any tips in this OMAP forum? :-)

Thanks

Regards!