AM5706: Reduce the Land (Pad) Pattern Size

Hideaki Matsumoto

Part Number: AM5706

Hi,

According to the data manual (page 394) of AM570x, the land (pad) pattern size is recommended as φ 0.35.

However, the customer wants to reduce the mounting pad size of AM5706 balls to φ 0.3.

Some application notes mention that “For optimal reliability, TI recommends a 1:1 ratio between the package pad and the PCB pad on the BGA. The ratio may be reduced to 1:0.8 if trace routing constraints make it absolutely necessary.”

https://www.ti.com/jp/lit/pdf/snoa021?keyMatch=AN-1126

From this description, can they reduce the land pattern size to φ 0.3 (1 : 0.8 = 0.35 : 0.28) by NSMD (Non-Solder Mask Defined pads)?

Thanks and regards,

Hideaki

over 2 years ago

+1 Bill McCracken over 2 years ago

TI__Expert 6995 points

Board designs should align with the recommended PCB land diameters given in the data sheet. In this case, 0.35mm diameter should be used. The 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. B) (ti.com) application note also recommends 0.35mm land diameter for 0.65mm pitched devices.

TI conducts Board Level Reliability testing on all packages using package BGA diameter to PCB land diameter ratio equal to 1:1. Only a few 0.8mm pitch FCBGA packages have ever been evaluated using ratios less than 1:1. This limited data is insufficient to apply across all BGA packages of different sizes & pitches.

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AM5706: Reduce the Land (Pad) Pattern Size