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TDA4VH-Q1: Do you have a TDA4VH-Q1 EVM which has a 12-layer or 10-layer stackup like SK-TDA4VM?

Hui-Liu
Expert 1420 points
Part Number: TDA4VH-Q1
Other Parts Discussed in Thread: SK-TDA4VM, AM69, SK-AM69, TDA4VH

Hi,

    Do you have a TDA4VH-Q1 EVM which has a 12-layer or 10-layer stackup like SK-TDA4VM?

    The current TDA4VH-Q1 EVM https://www.ti.com/tool/J784S4XEVM has a 16-layer stackup, and the pcb thickness is about 2mm. We think the pcb is too thick.

    We want a 12-layer or 10-layer pcb layout reference like SK-TDA4VM, we hope that the pcb thickness is 1.6mm.

    Thanks.

  • 0
    TI__Guru 51775 points

    The AM69 device is same package as J784S4 and has its own EVM:  https://www.ti.com/tool/SK-AM69

    However, I think it is also 16 layers.  Depending on your IO needs, you might be able to use similar stack-up to SK-TDA4VM.  The DDR interface should use same layers as SK-TDA4VM.  I believe the J784S4 has more differential IO (SERDES, CSI, etc) - so depending on how you use might help reduce layer count.  Power is another difference compared to SK-TDA4VM.  More power layers are needed to support the significantly higher power demands of the J784S4.  But again - depending on how you use IO might help reduce layer count.

  • 0
    Expert 1420 points

    Hi, Robert,

        Thanks for your reply.

        Are AM69 and TDA4VH-Q1 pin compatible?

  • 0 in reply to Hui-Liu
    TI__Guru 51775 points

    Yes.  The advantage of the SK-AM69 design is the PCB is PTH (drill) via only.  The TDA4VH EVM uses laser drill/micro-vias.