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AM6546: AM6546 Reflow

Willson Chen
Prodigy 31 points
Part Number: AM6546

Hi Experts,

Could you please provide recommended reflow profile of AM6546?

And, can we put AM6546 on the first side then reflow twice?

Thanks.

  • 0
    TI__Guru**** 158769 points

    Hello Willson Chen,

    Thank you for the query.

    We provide the below MSL rating.

    Pls let me know if this helps.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    Prodigy 31 points

    Hi Sreenivasa,

    Thanks for your reply.

    If we put AM6546 on the first side (B side) of the PCB then reflow soldering (B side -> A Side), is there any risks about AM6546 with reflow soldering two times?

    Thanks.

  • 0 in reply to Willson Chen
    TI__Guru**** 158769 points

    Hello Willson Chen,

    Thank you.

    Based on my quick review, refer below.

    Please read through the attached PDF.

    https://www.ti.com/lit/an/spraby1a/spraby1a.pdf

    Customer Board Assembly Reflow Profile for Lead Free Soldering

    As an initial starting point, the reflow profile shown in Figure 3 can be used with a typical range for the customer peak reflow temperature (Tp ) of 235°C - 250°C. For the customer production reflow soldering process, the peak reflow temperature (Tp) has to be lower than the classification reflow temperature (Tp ) shown in Table 2 and Figure 3. The reflow profile and peak temperature should be in line with the solder paste manufacturerer recommendation and all used component ratings on the customer application board. The package temperature is measured on the package top side in the package middle with a thin thermocouple glued to the package using a SMT glue that can withstand the maximum reflow temperature. The time from 25°C to the peak temperature is sensitive for the Flux. The Flux needs to still be active when the peak temperature is reached and the solderjoint is completing. Details for the maximum process time and temperature steps should be considered from the solder paste data sheet or discussed with the solder paste supplier for optimum process conditions. The IC packages are classified according to J-STD-020 and withstand three reflow cycles.

    I am also checking with the validation team and will update if i get some additional inputs.

    Regards,

    Sreenivasa