AM6442: Package Height Question

Brad Caldwell

Part Number: AM6442

I ran into an issue recently on one of our processors and I was wondering if you could help provide some details. The part in question is XAM6442ASFGGAALV. The drawing shows the height range from the bottom of the ball grid array but I was looking for some details on what the height would be after soldered to the PCB. Is there data on the collapse of the ball and how that affects the overall height; I am looking for some details for a thermal pad so knowing the height after soldering will be very helpful.

would it be overall height (2.652, 2.332) minus seating plane 0.15?
Why are there two numbers for the overall height, is that the range given a tolerance?,
What does TYP mean, typical?

over 2 years ago

0 Kallikuppa Sreenivasa over 2 years ago

TI__Guru**** 211030 points

Hello Brad Caldwell

Thank you for the inputs.

Let me check internally if there is any information that could be shared.

Brad Caldwell said:
What does TYP mean, typical?

I need to check but my understanding is same dimension applies for all the pins or all sides when pitch is being measured.

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa over 2 years ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 211030 points

Hello Brad Caldwell

Please refer below inputs i received

The height in the package drawing talked about the physical property of the package.

The final height of the package will depend on the stencil design and solder paste
shrinkage. If the customer can provide their stencil design file including thickness
and the solder paste type, I can estimate the final package height for them.

Regards,

Sreenivasa

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AM6442: Package Height Question