Part Number: TDA4VM
Hi TI experts,
I'm working on proprietary equipment that has been designed around the schematic of the tda4vm-sk evaluation board (PN: J721EXSKG01EVM). I'm going to perform measurements in the scope to verify the power consumption in different temperature conditions (from -40 to + 50 Celsius degrees as external temperature). I'm trying to consider an operational worst case where all relevant peripherals and cores of the SoC are loaded as much as possible. In particular I'm running on the several cores and DSPs an infinite loop to consume CPU cycles. In normal environment temperature (around 25 Celsius degree) I'm currently observing a gap between the estimated and the measured power consumption on TDA4 in the order of 5/6 W. I'm concerned I'm not loading the system in the proper way. I'd like to know whether TI provides a thermal test bench suite for TDA4VM and if you have any hint about the proper way to implement tehrnal test in order to validate my design.
Thanks, in advance