Does anyone know what the composition of the 'heat slug' which forms the top of the S-PBGA-N697 package for the TMS320C6455? Will this accommodate thermal conductive tape and a heatsink?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Does anyone know what the composition of the 'heat slug' which forms the top of the S-PBGA-N697 package for the TMS320C6455? Will this accommodate thermal conductive tape and a heatsink?
It will take thermal conductive tape. I'll have to get back with you one what the actual material is.
Best Regards,
Chad
Hi Chad,
How bout the adhesive which holds the heat slug to the BGA? is there a certain grade being used?