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AM623: Heat sink specs

WS
Prodigy 10 points
Part Number: AM623

Hi, we are looking to use the AM6234ATCGHAALW processor in a 40 degree Celsius ambient environment, with 15W of typical heat dissipation, and with cooling by natural convection only (no fans). May I know what would be the recommended heat sink size and specifications? Thank you.

  • 0
    TI__Guru**** 158619 points

    Hello WS,

    Thank you for the query.

    We do not use heat sink on the EVM and do not have a recommendation.

    We have thermal model that you could use for simulation.

    Refer below some suggestions to consider

    This is a FCCSP with package designator ALW0425A.

    425 solder balls with 0.3mm diameter. Each solder ball can take up to 0.78N. So for this package, it can withstand up to 331N
    with pressure apply on the top.

     If customer want to apply a heatsink on top of the package, the pressure apply on the top should not exceed 331N.

     Besides, this kind of package doesn’t has a thermal pad or heatsink on the package top. Adding a heatsink on
    top of the mold compound will improve thermal dissipation no more than 10%. Not very efficient.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    Prodigy 10 points

    Hi Sreenivasa, thanks for the useful information. Does this mean that the AM6234ATCGHAALW processor usually does not require a heat sink, since the thermal dissipation through the heat sink is so small? Thank you.

  • +1 in reply to WS
    TI__Guru**** 158619 points

    Hello WS,

    Thank you.

    WS said:
    Does this mean that the AM6234ATCGHAALW processor usually does not require a heat sink, since the thermal dissipation through the heat sink is so small?

    This is correct. Adding the heat sink may not provide the benefits you would look out for when using a heatsink.

    Regards,

    Sreenivasa