TDA4VM: How to use TIFS？

Hi Ni Hua,

For the first question, I would suggest using the TIFS which is part of the release. 

For the second question, i would request Diwakar to help.

Regards,

Brijesh

Hi Brijesh,

    For the first question, could you provide the detailed path for obtaining tifs in SDK Version: 08_06_00_12 specific to my chip model?

thanks.

Hi Ni Hua,

tifs.bin file is available in the PDK drivers, please find them in ti-processor-sdk-rtos-j721e-evm-08_06_00_12\pdk_jacinto_08_06_00_31\packages\ti\drv\sciclient\soc\V1 path for j721e.

Regards,

Brijesh

Hi Brijesh,

    Based on the chip type I provided, which one should I use from the options below?

thanks.

Hi Ni Hua,

I am not sure if TDA4VM88T5BALFQ1 is a GP or HS device. So can you please check with your local TI support/FAE to get this information?

If it is GP device, you should use tifs.bin file.

For HS device, depending on silicon revision, you need to use either tis-fs-enc.bin (for 1.0 silicon), tifs-sr1.1-hs-enc.bin (for 1.1 silicon), or tifs_sr2-hs-enc.bin for (for 2.0 slicon).

Regards,

Brijesh

Hi Brijesh,

    I am using an HS device with SR1.1, and currently, I have selected tifs_sr1.1-hs-enc.bin in SDK Version: 08_06_00_12. However, during security boot stress testing, I found that using this tifs causes a hang during the signature verification phase. When I switched to tifs_sr1.1-hs-enc.bin under SDK 08_02_00_05 for testing, the hang issue during the signature verification interface did not occur.

    Do you have a solution for this phenomenon?

thanks.

Hi Ni Hua,

What is stress testing? What is the boot flow that you are using? Can you please provide some more information on it? 

Do you have a TIFS log from WKUP UART? 

Regards,

Brijesh

Hi Brijesh,

    Please take a look at my following link:https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1309337/tda4vm-the-secure-boot-stress-test-may-encounter-a-freeze-issue/4990069#4990069 

thanks.

Hi Ni 

Can you please confirm whether you are using prime device or not?

Regards
Diwakar

Hi Diwakar,

    My chip model is TDA4VM88T5BALFQ1, and it is a non-primer chip.

thanks.

Hi Ni 

I got to know that you tested with SDK 8.6 + 9.1 TIFS and the issue seems to be disappear can you update on that.

As you are using correct tifs let close this issue and continue on the other thread.

Reagards
Diwakar

Hi Diwakar,

Thank you for your response. I have two more questions for confirmation:

1. When using the TI Dummy key, I can only update the tifs_sr1.1-hs-enc.bin from SDK 9.1 for customers but cannot provide the entire SDK 9.1. This is because the customer's current images, such as sbl_cust_img_mcu1_0_release.tiimage, are developed based on SDK 8.6. Will this lead to compatibility issues?

2. When using the customer's smpk.pem, I understand that I need to use the customer's smpk.pem with the command ./firmwareHeaderGen.sh j721e_sr1_1-hs to regenerate tifs_sr1.1-hs-enc.bin. Does this operation also need to be done in SDK 9.1? However, the customer's images like sbl_cust_img_mcu1_0_release.tiimage are developed based on SDK 8.6. Are there any compatibility issues in this case?

    Can you please respond as soon as possible? The resolution of this issue has been taking a considerable amount of time, and we need to address it promptly.

thanks..

Hi Ni 

Ni Hua said:

When using the TI Dummy key, I can only update the tifs_sr1.1-hs-enc.bin from SDK 9.1 for customers but cannot provide the entire SDK 9.1. This is because the customer's current images, such as sbl_cust_img_mcu1_0_release.tiimage, are developed based on SDK 8.6. Will this lead to compatibility issues?

Ideally we there should not be any backword compatibility issue while using 8,6 SDK with the 9,.1 TIFS .

Ni Hua said:

When using the customer's smpk.pem, I understand that I need to use the customer's smpk.pem with the command ./firmwareHeaderGen.sh j721e_sr1_1-hs to regenerate tifs_sr1.1-hs-enc.bin. Does this operation also need to be done in SDK 9.1? However, the customer's images like sbl_cust_img_mcu1_0_release.tiimage are developed based on SDK 8.6. Are there any compatibility issues in this case?

What this command does is "./firmwareHeaderGen.sh j721e_sr1_1-hs" it generates the outer certificate of the DMSC fw inner certificate  (located under  <pdk>/packages/ti/drv/sciclient/soc/sysfw/binaries/ ) with the key SMPK. And the resulted binary get stored  under path <pdk>/packages/ti/drv/sciclient/soc/V1/

This process is already followed whilie packaging the SDK and the resulted binary are present in <pdk>/packages/ti/drv/sciclient/soc/V1/

so you don't need to run any command and you can use the tifs binary from 9.1 directly.

Regards
Diwakar