TDA4VE-Q1: Flash Driver for Winbond W35 OSPI NAND

Hello,

MCAL FLS module is AUTOSAR Compliant for 4.3.1 but currently it supports OSPI NOR Flash only.Please look into URL for more details https://software-dl.ti.com/jacinto7/esd/processor-sdk-rtos-jacinto7/latest/exports/docs/mcusw/mcal_drv/docs/drv_docs/ug_fls_top.html

Regards

Tarun Mukesh

Hello Tarun

I am with Winbond. Since W35N OSPI NAND is used as replacement to OSPI NOR Flash in applications, TI should provide same support (FLS, MCAL) for W35N as provided to OSPI NOR. I noticed (link below) that currently only two OSPI NOR devices are supported. How can we co-work to ensure that erase/program/read and BBM is also fully supported for W35N. Winbond offers simplied way to implement BBM with instruction A1h (described in data sheet), and we can provide application note for more details. 

MCUSW: Fls User Guide (ti.com)

Refer to section "Driver Adaption for QSPI and new FLASH device"

Thanks.

Hello Anil,

We have an internal ticket for MCAL FLS NAND driver, the team is evaluating the advantages and will decide which SDK it will dispositioned.So if you have any points to convey please let me know.

Regards

Tarun Mukesh

Hello Tarun

You should have Automotive data sheet for W35N01JW and W35N02JW as well as our application note "AN0000050 Bad Block Management for QspiNAND and Octal NAND". Winbond website only has Industrial data sheets publicly available, and Automotive data sheets are only available on request. I sent you request for friendship, and I can send you automotive data sheets privately thru email once you accept request for friendship. Please let me know if there is another way to send automotive data sheets thru private email. I can ask Santosh (who initiated this ticket) if he can send you data sheets.

The application note AN0000050 is available on our website, but please let me know if you have difficulty to access it. Some of details below are based on AN0000050.

Our goal was to have our NAND be "NOR look-alike". We have unique and simplified way to implement BBM, and key points are following:

1. W35N automotive grade parts are shipped with ZERO bad blocks from factory. This means there is no need to worry about initial bad block markers etc for W35N automotive grade parts 

2. Bad block is triggered by E-fail=1 or P-fail=1 during lifetime

3. Once A1h instruction (followed with bad block address e.g. block-2 and good replacement block address e.g. block-1004 in Fig-3 and Fig-4) is executed, physical block 1004 will be automatically selected in future when logical address for block 2 is inputted. The figures 3 and 4 are for W25N QspiNAND with 1024 blocks (1 block = 1Mb) in 1Gb array, while W35N Octal NAND has 512 blocks (1 block = 2Mb) in 1Gb array. It is up to user to select address location of the replacement blocks  

4. W35N01JW 1Gb is single die. But in case of stack dies, e.g. W35N02JW 2Gb as stack of 2x1Gb dies, BBM has to be carried out separately for each 1Gb die

Please let me know if I can be further help.

Thanks.

Hello Tarun,

May I know which SoC are you considering SDK development and is there anyway to send the private email as i like to send you automotive data sheets for W35N01JW and W35N02JW as well as Winbond application note "AN0000050 Bad Block Management for QspiNAND and Octal NAND"

Hello Anil, Santosh,

Thanks for sharing the inputs. I would discuss with the team and will get back to you.

1.Are you both from Winbond ? if not can you please clarify me who are from which organization ?

2.Yes , you can email to me at t-puvvada@ti.com .But please wait till next week as i won't be available next few days.

Regards

Tarun Mukesh

Hello Tarun

I am with Winbond in California.

Regards

Anil Gupta, Winbond USA

Hello, 

I am currently out of office will get back to you by Monday.

Regards 

Tarun Mukesh 

Hello Tarun

I hope you are back at office now.

I sent W35N01JW/W35N02JW automotive data sheets and BBM app note to your TI email, and also copied some others at TI including my contacts in TI USA team with whom I have similar discussion.

We are looking forward to TI help with MCAL (FLS) for our W35N OSPI NAND products, so that W35N can be fully supported similar to two OSPI NOR Flash products currently supported with MCAL by TI.

We can also talk on TEAMS further, as needed. Thanks for your help.

Regards

Anil Gupta

Hello Tarun

If it is OK with you, you may want to keep thread open if Santosh has any questions, as thread was started by him. But my discussion with you and TI team can be thru email now.

Regards

Anil Gupta

Hello Anil and santosh,

Santosh If you have questions , you can reopen by commenting it here.

Regards

Tarun Mukesh