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Hi.
1. I want to get the height(h) from PCB to TDA4VE after reflow (including tolerance)
could you check the correct height
1)Total h (2.245 ~ 2.473) - after reflow(0.15) = 2.095 ~ 2.323
2) package h (1.95 ~ 2.154) - after reflow(0.15) = 2.057 ~ 2.361
2. If we use build-up(HDI) PCB, would it be the recommended specification to use PCB PAD 0.35mm / SMO 0.45? (NSMD type)
This E2E post discusses the definition of 'Seating Plane'
Attached is document that discusses pad sizes for both pad defined and solder masked defined solutions (for 0.8mm pitch devices)