This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TDA4VE-Q1: Package height and BGA PCB pad size

Part Number: TDA4VE-Q1

Hi. 

1. I want to get the height(h) from PCB to TDA4VE after reflow (including tolerance)

could you check the correct height 

 /resized-image/__size/300x239/__key/communityserver-discussions-components-files/791/1524.package.png

1)Total h (2.245 ~ 2.473) - after reflow(0.15) = 2.095 ~ 2.323 

2) package h (1.95 ~ 2.154) - after reflow(0.15) = 2.057 ~ 2.361 

2. If we use build-up(HDI) PCB, would it be the recommended specification to use PCB PAD 0.35mm / SMO 0.45? (NSMD type)