TDA4VE-Q1: Package height and BGA PCB pad size

Hi. 

1. I want to get the height(h) from PCB to TDA4VE after reflow (including tolerance)

could you check the correct height 

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1)Total h (2.245 ~ 2.473) - after reflow(0.15) = 2.095 ~ 2.323 

2) package h (1.95 ~ 2.154) - after reflow(0.15) = 2.057 ~ 2.361 

2. If we use build-up(HDI) PCB, would it be the recommended specification to use PCB PAD 0.35mm / SMO 0.45? (NSMD type)