Other Parts Discussed in Thread: TPS62873, TPS62871
Hello.
My name is HyunJae Yu and I am Automotive HW Engineer.
I am developing the new product by using the TDA4AL-Q1.
Recently I have done Thermal Analysis about my ECU.
But, the result is fail.
(I want show the result by image but I can't upload the image because of the company security policy.)
The bigget reason for fail is that TDA4AL is using too much Power.
(1) TDA4AL Thermal Power
I receive the file "J721S2PowerEstimationTool_v0p2.xlsm"by FAE.
I select the Use Case "UC-FUS-8MP_Front_3MP_Rear." and total power Thermal power is about 11W. It's too big.
(2) TI's Power Solution
I heard that TDA4AL generates a lot of heat from other HW team.
And when I check the Jacinto7 J721S2 Pwr Solution, Power IC output current is very high.
(For example)
- TPS62873 : 15A
- TPS62871 : 18A (9A * 2EA)
(3) 12V current
When I check the main input 12V current, TDA4AL is using more & more current than other company AP even if there is no Logic SW in the TDA4AL.
- TDA4AL : about 600mA (No Logic SW in the AP. Maybe only Driver SW is including / Uart, I2C, EMMC and so on.....)
- Other company AP : about 300mA (Full SW in the AP including the Logic SW)
** If Logic SW is used in the TDA4AL, current will be more increase than 600mA.
When I consider the above point,
I think that TDA4AL is not suitable for Automotive.
If I use the TDA4AL for automotive, do I have to use the any special structure for Heat Dissipation?
So, can you check other automotive product (using TDA4AL) information including Heat Dissipation Structure?