[FAQ] RE: AM623: Package ALW contact pressure specification for thermopad

Kallikuppa Sreenivasa

In customer's current AM6232 design they have to use a heat sink on top of MPU.

A “ThermoPad” is then used between the heat sink and AM6232.

In order for this to work correctly, a certain amount of contact pressure is required.

I don't think there will be any serious pressure damage at this point, but the manufacturer of the ThermoPad asks about permissible pressure loads for the ALW housing.

Can you give me some information about this?

11 months ago

+1 Kallikuppa Sreenivasa 11 months ago

TI__Guru**** 155789 points

Hello Dirk

Please refer below inputs received.

This is a FCCSP with package designator ALW0425A.

425 solder balls with 0.3mm diameter. Each solder ball can take up to 0.78N. So for this package, it can withstand up to 331N
with pressure apply on the top.

If customer want to apply a heatsink on top of the package, the pressure apply on the top should not exceed 331N.

Besides, this kind of package doesn’t has a thermal pad or heatsink on the package top. Adding a heatsink on
top of the mold compound will improve thermal dissipation no more than 10%. Not very efficient.

Regards,

Sreenivasa

+1 Kallikuppa Sreenivasa 8 months ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 155789 points

Hi All,

Additional inputs on the Lid

What are the purposes of the lid? Is it for EMC, thermal dissipation, mechanical protection, or something else?

It is required to protect the device, but it also helps with thermal dissipation.

Regards,

Sreenivasa

0 DJ-NG 8 months ago in reply to Kallikuppa Sreenivasa

TI__Genius 9355 points

Hi!

It is meant for thermal dissipation.

BR Dirk

0 Kallikuppa Sreenivasa 8 months ago in reply to DJ-NG

TI__Guru**** 155789 points

Hello Dirk

Noted and Thank you.

Regards,

Sreenivasa

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[FAQ] RE: AM623: Package ALW contact pressure specification for thermopad