This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TDA4VM: [ADAS_PRK1.5A][J721E] CDD IPC Profiling Application Build error at Window environment

Part Number: TDA4VM

Hello, TI team.

I want to build the CDD IPC Profiling Application at window environment by using mcusw in ti-processor-sdk-rtos-j721e-evm-09_00_01_01.

Becauese CDD IPC Profiling Application is not provided with j721s2 sdk yet.

When i build,  i got an error below like this..

make -sj16 cdd_ipc_profile_app BOARD=j721e_evm SOC=j721e BUILD_PROFILE=debug CORE=mcu1_0 BUILD_OS_TYPE=freertos
Nothing to be done for j721e i2c_indp
Nothing to be done for j721e i2c_profile
Nothing to be done for j721e i2c_profile_indp
Nothing to be done for j721e i2c_icss0
Nothing to be done for j721e fatfs_multi_indp
D:/Workspace/ADAS_PRK_1.5_PLUS/J721E_EVM/mcusw/build/rules_ti_cgt_arm.mk:232: *** multiple target patterns. Stop.
make: *** [cdd_ipc_profile_app] 오류 2
"make -sj16 cdd_ipc_profile_app BOARD=j721e_evm SOC=j721e BUILD_PROFILE=debug CORE=mcu1_0 BUILD_OS_TYPE=freertos" terminated with exit code 2. Build might be incomplete.

How to solve the multiple target patterns error for completing the CDD IPC Profiling Application build?