Because of the holidays, TI E2E™ design support forum responses will be delayed from Dec. 25 through Jan. 2. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TDA4AP-Q1: How to Sign & Encrypt Binaries & Image for SPL in SDK9.2

Part Number: TDA4AP-Q1

Hi TI Experts,

Customer is working on TDA4AP SDK9.2.

Now we successfully make our device become HS-SE after burning the dummy key (SMEK & SMPK provided by TI).

We know there are some application notes and guide for the next step to sign & encrypt the binaries & image, however they are more on SBL (customer is using SPL), and the recent SDK9.2 seems has some changes from the previous SDK.

Hence, may I know if you could summarize the steps needed to Sign & Encrypt Binaries & Image for SPL in SDK9.2 please?

Thanks!

Kevin