This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

AM3352: Efficient screening test procedures

Guru 10165 points
Part Number: AM3352


Tool/software:

Hi Support Team,

I have the following request from our customer using AM3352.

During the test phase of mass production, there are cases in which even products with extended temperature range fail to operate at low temperatures.
Under this condition, it is not possible to ship without screening.
And since the products are shipped in a large quantity, it is quite difficult to test the startup of all products in a -10°C environment, for example.
Therefore, we would appreciate it if you could provide us with a method for efficiently screening products that fail to operate at low temperatures,
and any information that we can use to consider screening methods.

Could you give us some advice based on your available knowledge so far?

Best Regards,
Kanae

  • Hi Kanae,

    AM335x has been in production for long time now and with very high volume.  For an extended temp range device the customer should not be seeing issues at low temperatures from the AM3352 processor.   Has customer performed any A-B-A swap to confirm if low temp issues follows the AM3352?  What is their run rate and fail rate?  Any additional information on what is being performed during fail?  ie "fails to boot linux at < -10C for example" and any logs?   If there is found A-B-A swap confirmation, then I'd recommend to work with customer and region's FQE on a returns reguest for analysis :   Customer returns | Additional information | TI.com

  • Hi James,

    Thank you for your support.

    A-B-A swap has not been implemented yet, but the power supply startup sequence at normal
    and low temperatures on the defective board and the SYSBOOT status are currently being checked, etc.,
    after which the A-B-A swap will be done.
    In addition, the SBL has been changed so that the LED is lit instead of the log output at boot time,
    and the lighting of this LED has not been confirmed at low temperatures.

    The execution and failure rates are as follows.

    [0 - 90°C device]
    1/19 unit: 100% failure to boot at 0°C. 100% bootable at room temperature.

    [-40 - 105°C device]
    4/5 units: 100% failure to boot at -10°C. 100% bootable at room temperature. 

    I will share your comments with my customer.

    Best Regards,
    Kanae