Tool/software:
TDA4VM
SDK 0900 linux+freertos
customer board
We are currently debugging TDA4 low power features, refer to pdk\packages\ti\drv\lpm\examples\lpm_example demo,now we can enter and exit LPM mode successfully.
However, there is a problem in low power mode, because MSMC and DDR belong to the main domain, neither can be used in LPM mode, so we can only run MCU10 programs in the MCU's 1MB SRAM
However, the MCU's SRAM is used by three programs in three phases, RBL,SBL, and APP, so the app phase can only use 512KB of SRAM at most, which is too little for our app.
Therefore, we refer to the datasheet to learn that the MCU domain can be external to nor flash(XIP) or RAM devices, but there are the following questions to consult
1.external nor flash(OSPI XIP mode)
(1).Whether it has been successfully used by other customers
(2).Compared with the use of SRAM, OSPI's XIP mode is likely to reduce the running efficiency of the program. How much will it be reduced? Does TI have relevant performance tests
2.external ram device
(1).Can we expand a 1MB or 2MB RAM device in the MCU domain? Does TI have relevant success stories or demos in the SDK
