Other Parts Discussed in Thread: TDA4VM,
Tool/software:
Dear Expert,
We are experiencing a critical boot failure with TDA4VM SR2.0 in high-temperature conditions. Here are the specific details
- Device: TDA4VM-Q1
- Versions tested: SR1.1 and SR2.0
- Test environment: ON/OFF Test in Chamber at 85°C ( 1min ON / 1min OFF )
Observed Behavior
- SR1.1 board: Normal operation (Current draw ~2.0A)
- SR2.0 board: Boot failure (Current draw ~1.4A)
Test Results
- Room Temperature:
- Both SR1.1 and SR2.0 operate normally
- High Temperature (85°C):
- SR2.0 fails after 1-2 operations
- AP stops functioning
- OSPI read failure occurs
- Verified on two different SR2.0 boards with identical results
Possibility Technical Analysis
- The issue appears to be related to OSPI block impedance changes at high temperatures
- The automatic tuning range seems to be exceeded, causing read failures
- Possible internal impedance variations between SR1.1 and SR2.0
Questions
- Is this a known issue with SR2.0 in high-temperature conditions?
- Are there any recommended modifications for the OSPI interface resistance values?
- What are the specific differences between SR1.1 and SR2.0 regarding the OSPI block characteristics?
- Are there any firmware updates or workarounds available for this issue?
We would greatly appreciate your guidance on resolving this critical issue affecting our production environment.
