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TDA4VEN-Q1: SoC package model for LPDDR4 simulation

Part Number: TDA4VEN-Q1


Tool/software:

Hi.

According to Datasheet "spracn9f, page of 21", SPICE model or S-parameter must be used for DRAM package models.

Can you also provide a package model (LPDDR4 IF) for TDA4VEN?

Best regards,

Yamamoto.