Tool/software:
Hi.
It seems that Pad on Via is not used for BGA wiring on the J722S EVM Board, why is this?
Is it because of reliability concerns, etc.?
Regards,
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Tool/software:
Hi.
It seems that Pad on Via is not used for BGA wiring on the J722S EVM Board, why is this?
Is it because of reliability concerns, etc.?
Regards,
The J722S EVM does use via-in-pad PCB technology - see many of the capacitors on the backside of the PCB opposite the processor. The PCB technology used is independent of the J722S processor - and I'm not aware of any reliability concerns using via-in-pad technology with J722S processor.
Hi. Robert-san,
I think Pad on Via is a common technology for high-density mounting, but if you have any reason for adopting Via in Pad, please let us know.
Regards,
The choice to use Via-in-Pad is left up to each customer and their requirements. J722S should be able to support either technology.