Are there any guidelines for supply bypassing for the DM814x? I'm using 0402 size, and there's limited room under the package where they're actually close enough to be effective. I can trade power/ground vias for bypass caps, and I'm trying to figure out what the proper balance is.The one guideline I can find is for the DDR3 interface, which says 70 high speed bypass caps are needed.
At the moment I'm giving priority to the LDOCAP pin bypassing, and that's taking up a lot of space. Is that the correct thing to do?
Looking at the Mistral EVM, there are relatively few caps under the chip. Most of them, especially for the DDR3 interface, are sprinkled around the outside, and many are routed quite poorly (eg 3 caps connected by a relatively long trace and a single via to the power plane). It seems they followed the DDR3 70-cap rule, without considering if they're using them effectively or not. Surely routing like this is not recommended?
