Tool/software:
Target device is TMS320VC5509AZAY
Customer have entered the following values for A, B, and C from the mechanical specifications on the data sheet, but are they correct? I think to be correct.
【(A) Ball Size(Diameter)】＝ 0.5 mm
【(B)SolderMask Opening】＝ 0.4 mm
【(C)BGA PAD Diameter】＝ 0.15 mm
Could you answer it?
Thanks and best regards,
Daisuke Nomura
Hi Daisuke,
A (ball size - diameter) is correct - 0.5mm (0.45mm - 0.55mm). This is not shown in the drawing, but is correct for this device.
B (solder mask opening is not correct. From the image, it appears you are looking a non solder mask defined pad, in which case the bga pad diameter (labeled as D above) should be 0.4mm, but the solder mask opening should be up to an additional 0.05mm per radius. So the soldermask opening should be 0.5mm or less.
C (BGA Pad diameter) is also incorrect. I see where you got 0.15mm from the drawing, but that label actually refers to something else. The bga pad diameter is the same as the ball size for this device - 0.5mm (0.45mm - 0.55mm).
Thanks,
Mike
