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AM62P: HEAT DISSIPATION SUGESSIONS FOR CONDUCTION COOLED APPLICATION

Part Number: AM62P

Tool/software:

Hi ,

We heve designed a Processor Board with AM62P for Conduction cooled application .Whether the chip can be used for conduction cooled application?

Querry

1. Processor Body to Chassis body(material : AL6061) Direct contact recommended ?

2. Interface material for Heat transfer between Processor Body to Chassis body?