PROCESSOR-SDK-J784S4: Booting both Linux and SDL application using the tiboot3.bin

Part Number: PROCESSOR-SDK-J784S4

Tool/software:

Hi team,

I am currently working on the Processor SDK version: 09_02_00_05

My requirement is to make the sbl_mmcsd_img_mcu1_0_release.bin boot Linux in the A72 core(Core ID = 0) and the ESM_main application in the MCU3_0(Core ID = 14)

I used the below commads to generate the muticore-image:

mono <Processor_SDK_RTOS_path>/pdk_j784s4_09_02_00_30/packages/ti/boot/sbl/tools/out2rprc/bin/out2rprc.exe esm_main_app_r5f_baremetal_release.xer5f test.rprc

<Processor_SDK_RTOS_path>/pdk_j784s4_09_02_00_30/packages/ti/boot/sbl/tools/multicoreImageGen/bin/MulticoreImageGen LE 55 output.appimage 0 <Processor_SDK_linux>/prebuilt-images/tispl.bin 8 test.rprc

I placed the following in the boot partition of the SD card:

  1. app (renamed output.appimage)
  2. tiboot3.bin (renamed sbl_mmcsd_img_mcu1_0_release.bin)
  3. tifs.bin
  4. u-boot.img
  5. uEnv.txt

but I am getting the below logs:

SBL Revision: 01.00.10.01 (Sep 29 2025 - 11:43:51)
TIFS ver: 9.2.4--v09.02.04 (Kool Koala)
Invalid magic number in boot image. Expected: 43525052, received: edfe0dd0
RPRC parse error
Invalid magic number in boot image. Expected: 43525052, received: ce300043
RPRC parse error

Can you validate the steps followed above?

Thanks and regards,

Poorneka T

  • Hi Poorneka,

    Please be aware that the TI resource assigned to this e2e is out office returning next week.  There will be a delay in response accordingly.

    Regards,

    kb