Dear all,
We have been working on our own DM3730 card. DM3730 with the CBP package option with a pop memory. Therefore several assembly options are being used such as 1-pass, 2-pass mentioned in spraav2.pdf. Also we try to assembly dsp first and pop later similar to 2-pass method. At every try, many of open solder joints (especially between dsp and pop) caused improper workings. What are we supposed to do not to have such problems?
