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AM2431: Why a substrate with Tg above 170 °C is used

O.H
Mastermind 6860 points

Part Number: AM2431

Hi experts,

The TMDS234EVM uses HiTg material(Iteq IT180A) with a glass transition temperature (Tg) of 170 °C or higher.
Could you please explain why a substrate with Tg above 170 °C is necessary?

Generally, I assume it’s for heat resistance and rigidity, but since this is a microcontroller board, it shouldn’t generate much heat, so I expect it’s to prevent warping.
I’d like to know if there are any other reasons. Because the material is hard, drilling and similar processes may have limitations. When looking ahead to mass production, I want to identify if there are any restrictions.

Best regards,
O.H

  • 0
    TI__Guru**** 211150 points

    Hello O.H

    Thank you for the query.

    I suspect the material has been selected to support industrial applications.

    Let me check with the EVM team and update.

    Please expect delay due to thanksgiving holidays.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    Mastermind 6860 points

    Hi Sreenivasa,

    Thank you for your reply. And sorry for rush you. Is there any update?

    Best regards,
    O.H

  • 0 in reply to O.H
    TI__Guru**** 211150 points

    Hello O.H

    Thank you for the follow-up.

    O.H said:
    And sorry for rush you. Is there any update?

    Understand. Will follow-up and update.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    TI__Guru**** 211150 points

    Hello O.H

    Refer below inputs i received

    The question for selection asked was with regards to cost vs performance trade-offs for different materials. IT180A outperforms something like 370HR on both fronts.

    Did you have a PCB material that you wanted to use for me to check.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    Mastermind 6860 points

    Hello Sreenivasa,

    Thank you for your reply.

    Below is some feedback from customers
    ===============

    To reliably achieve PCIe GEN2 communication, we believe equipment at the IT180A level is necessary—is it right?
    Also, is the selection of IT180A on EVM based not on prioritizing temperature, but rather on considering high-frequency characteristics?
    We typically use FR-4 NP-140TL, taking cost and other factors into account.
    This time, as we are considering PCIe GEN2 for the first time, we suspect that given the bit rate, the above NP-140TL characteristics may not be sufficient.

    We are considering AM2431—when using all its functions fully, to how extent does its temperature rise?
    The maximum estimate Ta is 50 °C.
    From the figure below, is it correct to calculate as: Max 1.9 [W] × 12.8 [RΘJA (Junction-to-free air)] = +24.32 [Ta]?


    ==========
    Best reragds,
    O.H

  • +1 in reply to O.H
    TI__Guru**** 211150 points

    hello O.H,

    Thank you for the inputs.

    O.H said:
    To reliably achieve PCIe GEN2 communication, we believe equipment at the IT180A level is necessary—is it right?
    Also, is the selection of IT180A on EVM based not on prioritizing temperature, but rather on considering high-frequency characteristics?
    We typically use FR-4 NP-140TL, taking cost and other factors into account.
    This time, as we are considering PCIe GEN2 for the first time, we suspect that given the bit rate, the above NP-140TL characteristics may not be sufficient.

    In case customer wants to select a safe PCB material, they can consider the EVM as the EVM has been tested by variety of customer and for a good time now.

    As i mentioned before the selection was more on availability, cost and also performance compared to some of the available alternate materials.

    I guess the customers PCN vendor may be able to share more insight.

    I shared all the inputs i received from the experts.

    O.H said:
    We are considering AM2431—when using all its functions fully, to how extent does its temperature rise?
    The maximum estimate Ta is 50 °C.
    From the figure below, is it correct to calculate as: Max 1.9 [W] × 12.8 [RΘJA (Junction-to-free air)] = +24.32 [Ta]?

    Would you mind starting a new thread for the query for the power experts to support.

    Regards,

    Sreenivasa

  • 0 in reply to Kallikuppa Sreenivasa
    Mastermind 6860 points

    Hello Sreenivasa,

    Thank you for your reply.

    Kallikuppa Sreenivasa said:

    In case customer wants to select a safe PCN material, they can consider the EVM as the EVM has been tested by variety of customer and for a good time now.

    As i mentioned before the selection was more on availability, cost and also performance compared to some of the available alternate materials.

    I guess the customers PCN vendor may be able to share more insight.

    I shared all the inputs i received from the experts.

    Just to be sure, let me confirm. Is ithat correct my understanding that "TI has no specifications or recommendations (restrictions) on PCB materials"?

    Kallikuppa Sreenivasa said:
    Would you mind starting a new thread for the query for the power experts to support.

    I understood.

    Best regards,
    O.H

  • +1 in reply to O.H
    TI__Guru**** 211150 points

    Hello O.H

    Thank you.

    O.H said:
    Just to be sure, let me confirm. Is ithat correct my understanding that "TI has no specifications or recommendations (restrictions) on PCB materials"?

    Correct,

    Regards,

    Sreenivasa