Hi,
Kindly reply to queries listed below.
- What is the PCB stack up for EVM816x_Gerber_RevE? (including Substrate thickness. We need this information to follow same differential pair separation to get required impedance. )
- Separation near memories for address/ CTRL Signal are not maintained. Up to what length this is acceptable.? (it is given in datasheet that it can be 1250 mils. Need confirmation to it.)
- what should be separation between VREF to any other signal?
Warm regards,
Kirti Makwana