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TMS320F28335: Peak Temperature Ranges

Jeff Steel
Prodigy 20 points

Part Number: TMS320F28335

I am using TMS320F28335ZJZS (RoHS) Level-3-260C-168 HR with 60/40 tin lead solder paste. The “MSL Ratings and Reflow Profiles” (SPRABY1A–February 2015–Revised December 2018 Rev. A) says peak reflow temperature is 235°C - 250°C and the “Forward/Backward Compatibility” (SNOA923–April 2014) Application Report says Lead-Free Process Peak Temperature Ranges from 240°C - 260°C.

What temperature range should I use?

 

MSL Ratings and Reflow Profiles (Rev. A)

“typical range for the customer peak reflow temperature (Tp) of 235°C - 250°C.”

 

Forward/Backward Compatibility

“Lead-Free Process (240°C - 260°C)”

 

Thanks.

  • 0
    TI__Mastermind 35533 points

    Hi Jeff,

    Use the 235°C – 250°C range.

    The two documents you're referencing serve different purposes, which is the source of the confusion:

    • 235°C – 250°C (from SPRABY1A) is the recommended customer peak reflow temperature for board assembly — this is the range you should target [1][2].
    • 240°C – 260°C (from SNOA923) describes lead-free process capability — it refers to what lead-free processes typically reach, not what you should set your oven to when using tin-lead solder.

    Since you're using 60/40 tin-lead paste (which melts at ~183°C), you don't need the higher lead-free temperatures. The 235°C – 250°C window gives you adequate margin above liquidus while staying safely below the device's 260°C classification limit.

    Key guidelines from TI documentation:

    • Your production peak temperature must stay below the 260°C classification temperature — it is an absolute ceiling, not a target [3].
    • TI prefers parts to be processed at the lowest peak temperature possible within the allowable range [4].
    • Follow your solder paste supplier's recommended reflow profile, as the exact profile depends on paste formulation, board complexity, and reflow equipment capability [1][4].
    • Consider all components on your board — if other parts have lower temperature ratings, those may further constrain your profile [2].

    Practical recommendation:

    Aim for the lower end of 235°C – 250°C (consistent with your solder paste manufacturer's guidance), and verify that your profile meets time-above-liquidus requirements for 60/40 tin-lead. This protects the device while ensuring reliable solder joints.

    1. TI MSL Ratings and Reflow Profiles (SPRABY1A)
    2. TI MSL Ratings and Reflow Profiles - Classification Limits
    3. TI Quality, Reliability & Packaging Data - TMS320F28335ZJZS
    4. TI Reflow Soldering Application Report (SLMA002H)

    Best Regards,

    Zackary Fleenor