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J7200XSOMXEVM: Difference of system-on-module options

Part Number: J7200XSOMXEVM

What is difference between system-on-module(soldered) and system-on-module(socketed)?

J7200XSOMXEVM looks two options for board. J7200SOMG01EVM and J7200XSOMS01EVM.

  • J7200SOMG01EVM is the standard EVM/development system.  This meets the requirements of most customers.

    J7200XSOMS01EVM is the same EVM, but the processor is replaced with a socket to allow processor to removed using bench tools (vs de-soldering).  This is sometimes needed when testing security fusing features.   

  • Thank you. If i want to evaluate high-security device, socket type is better?

  • TI's EVM J7200SOMG01EVM ships with a GP (non-secure) device.  The socketed version (J7200XSOMS01EVM) also ships with GP (non-secure) device.  However, customers can order secure silicon and swap-out on the socketed EVM, where changing on the standard EVM requires BGA replacement/re-soldering.

    Note we recommend not using the socket EVM unless absolutely required, as the sockets can be difficult to use. Exact pressure/torque is required, and incorrect use can damage the socket - making EVM unusable.  The standard EVM is much more robust/user-friendly.