Part Number: AM6412
Hi Support Team,
My customer is using the AM6412BSCGHAALV (FCBGA, ALV0441A, 441-pin, 17.2 × 17.2 mm, 0.8 mm pitch).
For their board-level reliability and assembly evaluation, the customer requires
the package-side (substrate) construction details listed below, which are not included
in the public datasheet (SPRSP56) .
1. Ball land (pad) diameter on the package substrate
2. Pad metal thickness
3. Solder resist (solder mask) opening diameter on the package side
4. Solder resist thickness
5. Whether the package pads are SMD or NSMD defined
I understand this information may be confidential / NDA-restricted.
Please advise the procedure to obtain it (e.g., under NDA, or a package
cross-section / mechanical construction document).
If a formal request form is needed, kindly let us know.
Best Regards,
Kanae