OMAPL138B-EP: Composition

Danilo A.

Hi Team,

I noticed in that the solder ball composition used in OMAPL138BGWTMEP, and a few other devices, is Sn 63%, Pb 34.5%, Ag 2%, and Sb 0.5%. Is there a reason why this was used instead of Sn63Pb37?

Regards,

Danilo

2 months ago

0 PaulM 2 months ago

TI__Mastermind 31025 points

Danilo

I will check, but I doubt I'll have that level of information available.

--Paul

0 Danilo A. 1 month ago in reply to PaulM

TI__Mastermind 34720 points

Hi Paul,

Thank you for your response.

Our customer would like to request an update.

Regards,

Danilo

0 PaulM 1 month ago in reply to Danilo A.

TI__Mastermind 31025 points

No update due to the holiday weekend. I’ll check again tomorrow

+1 PaulM 1 month ago in reply to PaulM

TI__Mastermind 31025 points

Danilo

As expected, no specific details other than this was done to improve solder joint performance.

--Paul

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OMAPL138B-EP: Composition