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C66 reliability figures

Other Parts Discussed in Thread: TMS320C6678

My company is currently designing for C66 DSP. As such, my reliability engineers are requiring some info on C66 DSP. It will be great if the following figures could be provided.

1. Reliability Test/Qualification Report

2. MTBF or failure rate figures

3. ESD Sensitivity Level 

4. MSL Level

5. Technology used for TI C66

Thanks.

  • Wenjun, is there a specific C66x device that you are looking at? The technology used for C66x devices is 40nm. From what I hear we expect to have the MTBF and FIT data published by 2Q 2012. Stay tuned.

  • The c66x device I am looking for is TMX320C6672CYP and TMS320C6678CYPA. For the technology used for C66x, is there special technology involved besides the 40nm technology? Example is:

    Intel I7 is using 3D Tri gate 22nm Transistors technology, Virtex 7 is using 28nm SSI Technology. 

  • Wenjun,

    The 40nm technology being used does not include any Stacked/3D/Parasitic Transistor technology.

    As mentioned the Qual Report is expected to be released in the 2Q12 timeframe.  Our expectation is to meet a 50 FIT (100K POH) @ Tj = 105C.  The information will be posted under the 'Quality and Environmental Data' which is on the device page http://www.ti.com/product/tms320c6678

    The ESD sensitivity is available today in the Data Manual.

    The MSL Rating (as well as Reflow Data) is already published on the external page - Level-4-245C-72HR

    Best Regards,

    Chad