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Thermal evaluation for C6A8168

Kanae
Guru 10085 points

Hi, all.
Regarding C6A8168 thermal evaluation, I would like to know the following check items.

1) Since I will use RθJC; Junction to Case Thermal Resistance, I would like to measure the case temperature.
   Is the measurement position of the temperature correct at the metal plate on top of device?

2) When a heat sink attaches on C6A8168, is there the upper limit value for the tightening torque?

Regards,
Kanae

  • 0
    TI__Mastermind 25055 points

    Hello,

    Yes, measure the temp on the top plate of the device.

    Regards,
    Marc

  • 0 in reply to MarcPyne
    Guru 10085 points


    Hi Marc,
    Thank you for your quick reply.
    Do you know the person who has an answer for question No.2 about the tightening torque value?

    2) When a heat sink attaches on C6A8168, is there the upper limit value
      for the tightening torque?

    Regards,
    Kanae

  • 0 in reply to Kanae
    TI__Mastermind 25055 points

    I am looking into it; I will let you know what I find out.

    Regards,
    Marc

  • 0 in reply to MarcPyne
    Guru 10085 points

    Hi Marc,
    Thank you for your support.
    Did TI suggest the proper value for the tightening torque
    to Spectrum Digital manufactured DM8168EVM?

    Regards,
    Kanae

  • 0 in reply to Kanae
    TI__Mastermind 43875 points

    Kanae,

    Torque is not the appropriate metric for this really.

    There are two main sets of forces to consider when affixing anything to the package.

    First there is a sheer force which is parallel to the PCB. This force causes stripping of the balls and/or PCB traces and landing pads.

    Second there is a compression force. This causes squashing of the balls and solder fractures.

    Torque is an angular measurement and is typically specified when there is a socket involved since most sockets have a large screw on the top which presses onto a plate which is in turn applies pressure to the top of the device. The correct torque, in this case, depends on both the socket used (due to the thread pitch in the pressure screw) and the max compression force the device can accept.

    What I think you really need to know is the max compression force the device can take.

    BR,

    Steve

  • 0 in reply to Steve Clynes
    Guru 10085 points

    Hi Stave,
    I really appreciate your reply.
    It is very helpful for me.

    TI provides "Hardware Design Guide for KeyStone I Devices" for C66x device.
    http://www.ti.com/lit/an/sprabi2b/sprabi2b.pdf
    It describes "Maximum Device Compression" for C66x device.

    Is there any HW guide for C6A816x including "Maximum Device Compression" information?

    Regards,
    Kanae