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Getting unresolved ipc symbols when trying to build a syslink example

Other Parts Discussed in Thread: SYSBIOS

Hi,

I have an application that I'm trying to get built that is based on the messageQ sample.  We have had this code since the DaVinci days and it runs under dsplink/dspbios but now I'm trying to get the application running on the dm816x with syslink/sysbios.

The first step I did was to build the ARM/DSP messageQ samples for the dm816x and that went OK.  Could build and run both sides no problem.

Problem came when I replaced the original messageQ sample with our modified version.  The DSP side is what I'm having trouble with.  About the only major difference between the original sample and our modified version is ours uses HeapBufMP and the sample used HeapMemMP.

I'm using the same build system as the samples and simply replaced the ARM & DSP messageQ code with our application if that helps.

I can't figure out why I'm getting these messages and hope someone can point me in the right direction.

Hear are the type of messages I'm seeing during the link phase of the dsp samples build:

warning: creating output section ".plt" without a SECTIONS specification

 undefined                                           first referenced                                                                                                                          
  symbol                                                 in file                                                                                                                               
 ---------                                           ----------------                                                                                                                          
 ti_sdo_ipc_heaps_HeapBufMP_Module__diagsEnabled__C  /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Module__diagsIncluded__C /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Module__diagsMask__C     /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Module__id__C            /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Module__state__V         /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Object__create__S        /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>
 ti_sdo_ipc_heaps_HeapBufMP_Params__init__S          /home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/ipc_1_23_05_40/packages/ti/sdo/ipc/lib/instrumented_e674/ipc/ipc.lib<Ipc.obj>

error: unresolved symbols remain
warning: entry-point symbol other than "_c_int00" specified:
   "ti_sysbios_family_c64p_Hwi0"
error: errors encountered during linking;
   "ti_syslink_samples_rtos_platforms_ti816x_dsp/debug/messageq_ti81xx_dsp.xe67
   4" not built
gmake[1]: *** [ti_syslink_samples_rtos_platforms_ti816x_dsp/debug/messageq_ti81xx_dsp.xe674] Error 1
gmake: *** [/home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/syslink_2_00_05_85/packages/ti/syslink/samples/rtos/messageQ,.executables] Error 2
make[2]: *** [RtosSamples] Error 2
make[2]: Leaving directory `/home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/syslink_2_00_05_85/packages'
make[1]: *** [samples_rtos] Error 2
make[1]: Leaving directory `/home/hutch/ti-ezsdk_dm816x-evm_5_03_01_15/component-sources/syslink_2_00_05_85'
make: *** [syslink_samples_rtos] Error 2
[linux-devkit]:~/ti-ezsdk_dm816x-evm_5_03_01_15>