Hi TI OMAP4 Support,
We are current finalizing last bits and pieces of a new OMAP4460 schematic/layout and have a few questions which I unfortunately don't find 100% clear from the DM/TRM and Blaze documentation.
1) What are the exact benefit of using the few GPIOs in the WakeUp (WK) domain? Reason for asking is that I would expect i.e. interrupt signal from WLAN to use a WK pin to be able to wake up OMAP from lowest power state, but according to Blaze schematics it's just using an ordinary GPIO. Any practical benefit/drawback from this compared to using a WK domain GPIO? TRM mainly states that WK pins are in wakeup domain, but not much more it's very hard to find any information when this would be needed/preferred (or an drawback) for a normal standard TI Android SW delivery?
2) Is it OK to pull sysboot pins directly to GND/VIO (instead of through a resistor) to save routing and component space in the OMAP area?
3) Should sysboot pins, intended to be LOW preferable be left floating (using internal pull down) or hardwired to GND (assuming hard wiring from question 2 above is allowed)
4) OMAP4460 DM chapter 6.2 suggest placing a TMP102 at one of three alternative places close to OMAP. Two of these places states 1mm from OMAP edge. How is this to be measured? To center/Edge of TMP102? Should TMP102 be turned any special orientation?
I hope you can help me forward with above questions...
Best regards and thanks in advance
Søren