This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Erros for Building configuration with 2GB DDR in DM8168 VCSDK

Other Parts Discussed in Thread: SYSBIOS

I want to build configuration with 2GB DDR in DM8168 VCSDK. Due to it does not describe how to build in VC SDK install guide. I follow the description of DM8168 DVR RDK install guid to build the configuration with 2GB DDR.

1. Open and edit <VC_SDK_BASE>/vc_rdk/Rules.make
2. set DVR_RDK_BOARD_TYPE = DM816X_DVR
3. Modify DDR_MEM to DDR_MEM_2048M in place of DDR_MEM_1024M
4. make -s sys_all

I met the errors as shown below.

"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 237: error:
   placement fails for object ".const", size 0x188d6 (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 239: error:
   placement fails for object ".fardata", size 0x2fc3 (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 227: error:
   run placement fails for object ".stack", size 0x4000 (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 248: error:
   placement fails for object ".vecs", size 0x5ff (page 0).  Available ranges:

   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 252: error:
   placement fails for object "ti_sdo_ipc_init", size 0x44b (page 0).
   Available ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 240: error:
   placement fails for object ".switch", size 0x27d (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 228: error:
   placement fails for object "GROUP_1", size 0x134 (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
"<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/obj/ti816x-evm/c6xdsp/debug/dvr_rdk_configuro/linker_mod.cmd", line 244: error:
   run placement fails for object ".cio", size 0x123 (page 0).  Available
   ranges:
   DDR3_DSP     size: 0xd00000     unused: 0xc          max hole: 0x4
warning: entry-point symbol other than "_c_int00" specified:
   "ti_sysbios_family_c64p_Hwi0"
error: errors encountered during linking;
   "<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/bin
   /ti816x-evm/dvr_rdk_c6xdsp_debug.xe674" not built
make[2]: *** [<VC_SDK_BASE>/vc_rdk/../vc_rdk/build/dvr_rdk/bin/ti816x-evm/dvr_rdk_c6xdsp_debug.xe674] Error 1
make[1]: *** [apps] Error 2
make: *** [dvr_rdk_bios6] Error 2

Why do the errors happen? How to fix the errors?

Thank you.