Hi All,
This post is regarding DM8168's DDR3 routing for top-bottom DDR placement. We know that for Netra top bottom DDR3 placement is possible as per the DM8168 datasheet DDR routing guidelines. Due to very stringent constraints on the PCB dimensions, we want to go for top-bottom DDR placement. In this regard we have the following queries:
1. Is it required to go for Micro-Via technology (blind or buried via) to achieve the same?
2. Are there any specific routing guidelines apart from the ones mentioned in the DM8168 datasheet?
3. What is the recommended board stack up for doing top bottom DDR routing?
4. If this can be achieved in a conventional PCB (without use of Micro via) what is the recommended via size (drill, pad and anti-pad) to be used?
Regards,
Shareef