Dear TI,
I am implementing an AM335x ZCE layout and was going through all the DRC errors when doing via-channel. One item I do not see specified in the following wiki: http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design is what to do with soldermask clearance DRC constraints. For these type of 0.65mm pitch designs, what is the recommended soldermask expansion?
-Jason