This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

AM335X ZCE Layout

Dear TI,

I am implementing an AM335x ZCE layout and was going through all the DRC errors when doing via-channel. One item I do not see specified in the following wiki: http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design is what to do with soldermask clearance DRC constraints.  For these type of 0.65mm pitch designs, what is the recommended soldermask expansion?

-Jason

  • Depending on your specific PCB constraints accounting for trace widths, pad sizes, and spacing requirements, you could go with up to + 0.004 on the solder mask on the ZCE package.  You should verify your particular board details though with your PCB fabricator to make sure you do not have manufacturing issues.